3D-Stacked Memory

PIMS: A Lightweight Processing-In-Memory Accelerator for Stencil Computations
A Conference Presentation for our paper “PIMS-A Lightweight Processing-In-Memory Accelerator for Stencil Computations” at MEMSYS 2019.
Oct 1, 2019 12:00 AM — Oct 3, 2019 12:00 AM Washington DC, USA
Jie Li, Xi Wang, Antonino Tumeo, Brody Williams, John D. Leidel, Yong Chen
PIMS: A Lightweight Processing-In-Memory Accelerator for Stencil Computations
MAC: Memory Access Coalescer for 3D-Stacked Memory
Emerging data-intensive applications, such as graph analytics and data mining, exhibit irregular memory access patterns. Research has …
Xi Wang, Antonino Tumeo, John D. Leidel, Jie Li, Yong Chen
Aug 1, 2019
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